The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 22, 2002
Filed:
Jan. 11, 2000
Applicant:
Inventor:
Yong-suk Jin, Kyungki-do, KR;
Assignee:
Samsung Electronics Co., Ltd, , KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/900 ; H01L 2/362 ;
U.S. Cl.
CPC ...
H01L 2/900 ; H01L 2/362 ;
Abstract
A method for fabricating an integrated circuit device includes the steps of forming first and second conductive regions on a substrate. The second conductive region is divided into first and second subregions wherein the first subregion is adjacent the first conductive region. More particularly, the surface area of the first subregion is not more than ten times greater than the surface area of the first conductive region. The first and second subregions can then be electrically connected to complete the second conductive region. Related structures are also discussed.