The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 22, 2002
Filed:
Jul. 06, 2000
Misao Fujikawa, Ishikawa, JP;
Sodick Co., Ltd., Kanagawa, JP;
Abstract
An injection molding machine mold clamping device ( ) comprising an electromechanical mold opening and closing mechanism, a hydraulic mold clamping. mechanism, and a mold thickness adjustment device, said mold thickness adjustment device comprising a first detection device ( ) for detecting the position of a mold clamping ram ( ), a second detection device ( ) for optically detecting the position of a half nut device ( ), and a mold clamping ram position control device ( ) for hydraulically holding and controlling the position of the mold clamping ram ( ). The position of the half nut device ( ) is held by hydraulic control at the mold thickness adjustment position during mold opening and closing. In the initial mold opening and closing operation, the large mold opening force exerted by the mold clamping ram ( ) may be used to open the mold.