The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 15, 2002

Filed:

Nov. 30, 2000
Applicant:
Inventors:

Senol Pekin, San Jose, CA (US);

Sunil A. Patel, Los Altos, CA (US);

Assignee:

LSI Logic Corporation, Milpitas, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01R 3/126 ;
U.S. Cl.
CPC ...
G01R 3/126 ;
Abstract

A method for measuring electromigration includes the steps of measuring a corresponding voltage increase across an interconnect as a function of time for a plurality of nonzero heating rates and calculating an interconnect integrity from the voltage increase.


Find Patent Forward Citations

Pekin, Senol. (2002). Non-isothermal electromigration testing of microelectronic packaging interconnects (U.S. Patent No. 6466038). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6466038

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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