The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 15, 2002
Filed:
Sep. 18, 2000
Futoshi Tokunoh, Tokyo, JP;
Mitsubishi Denki Kabushiki Kaisha, Tokyo, JP;
Abstract
A compression bonded type semiconductor device including a semiconductor substrate having a gate electrode and a cathode electrode formed on a first surface and an anode electrode formed on a second surface opposite to the first surface, an external cathode electrode disposed so as to be compression bondable to the cathode electrode, and an external anode electrode disposed so as to be compression bondable the anode electrode. Also included is an insulating cylinder containing the semiconductor substrate, an external gate terminal having an outer peripheral portion protruding to an outside of the insulating cylinder and having a protrusion at an inner peripheral portion configured to about said gate electrode, and an elastic body configured to press the protrusion of the external gate terminal to the gate electrode.