The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 15, 2002
Filed:
Mar. 20, 2001
Applicant:
Inventors:
Masanori Iida, Katano, JP;
Hiroyuki Asakura, Osaka, JP;
Assignee:
Matsushita Electric Industrial Co., Ltd., Osaka, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 3/10203 ;
U.S. Cl.
CPC ...
H01L 3/10203 ;
Abstract
A semiconductor device package having a heat radiating base that has a depression. A circuit substrate is disposed on the heat radiating base to cover at least the depression. At least two semiconductor devices are mounted on both sides of the circuit substrates. The semiconductor device mounted on one major surface of the circuit substrate is coupled to the heat radiating base and is disposed in the depression.