The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 15, 2002
Filed:
Sep. 13, 2000
Edwin R. Fontacha, San Jose, CA (US);
Viswanath Valluri, Sunnyvale, CA (US);
Advanced Micro Devices, Inc., Sunnyvale, CA (US);
Abstract
A semiconductor package is provided including a die bearing a plurality of bonding pads and a substrate connected to the die by a connecting agent, the substrate including a plurality of conductive traces forming a wiring pattern, a plurality of vias forming a matrix, and an opening at a position corresponding to the plurality of bonding pads. A plurality of conductive elements fill the vias and at least one trace electrically connected to a conductively filled via disposed adjacent a first side of the tape window is routed to a second side of the tape window to form a beam lead projecting into the tape window from the second side. The beam lead is electrically connected to one of the bonding pads.