The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 15, 2002
Filed:
Mar. 09, 2001
Applicant:
Inventor:
Jeffrey Brian Barton, Goleta, CA (US);
Assignee:
Indigo Systems Corporation, Goleta, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/14763 ;
U.S. Cl.
CPC ...
H01L 2/14763 ;
Abstract
Methods for forming die that have minimal edge and surface damage are provided. Die formed by these methods are less susceptible to cracking and breakage. Thus, yield and performance of devices fabricated with die formed by these methods are advantageously improved. To form the die, trenches are formed in a wafer around the peripheral edge of the die by processes that cause only minimal damage to the edges of the die. The wafer is cut through the trenches into sections containing the die without contacting the edge of the die. The sections are then mounted onto a holder and thinned to produce the die.