The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 15, 2002
Filed:
Jun. 12, 2001
Frank Kuo, Kaohsiung, TW;
Siliconx (Taiwan) Ltd., Kaohsiung, TW;
Abstract
A power semiconductor die has a drain contact, a source contact, and a gate contact. A lead frame has first, second, and third terminals. A metal sheet has first and second contacting portions and a bridging portion interconnecting the first and second contacting portions. The power semiconductor die is mounted on the lead frame such that the drain contact is connected to the first terminal. The metal sheet is attached to the top surface of the power semiconductor die and the second and third terminals of the lead frame such that the source contact and the second terminal are connected to the first contacting portion, and such that the gate contact and the third terminal are connected to the second contacting portion. The bridging portion is subsequently cut for disconnecting electrically the first and second contacting portions.