The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 15, 2002
Filed:
Dec. 07, 1999
Applicant:
Inventors:
Masayuki Kamite, Tokyo, JP;
Konomi Hasumi, Tokyo, JP;
Nobuhiro Mukai, Toyama, JP;
Masaaki Shibazaki, Toyama, JP;
Kaori Fujita, Toyama, JP;
Assignee:
Other;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 4/122 ; B29C 3/912 ;
U.S. Cl.
CPC ...
B29C 4/122 ; B29C 3/912 ;
Abstract
The method for producing a molded resin product with a simulated wood grain pattern on an exterior surface according to the present invention comprises the steps of: supplying a first molten resin into a mold cell to form a resin layer with said exterior surface; making a plurality of grooves through said resin layer so as to reach said exterior surface before said molten resin solidifies; filling up said grooves with a second molten resin such that said exterior surface exhibits simulated wood grain patterns; and solidifying said first resin and said second resin.