The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 15, 2002
Filed:
Jun. 29, 2000
Michael J. Berman, West Linn, OR (US);
Jayashree Kalpathy-Cramer, West Linn, OR (US);
LSI Logic Corporation, Milpitas, CA (US);
Abstract
An apparatus for planarizing a surface of a semiconductor wafer includes a wafer support configured to receive the semiconductor wafer so that the surface of the semiconductor wafer projects from the wafer support. The apparatus also includes a polishing member configured in the form of an endless unitary belt which is devoid of seams. The endless unitary belt is (i) positioned in contact with the surface of the semiconductor wafer and (ii) capable of moving in a linear direction relative to the surface of the semiconductor wafer so as to planarize the surface of the semiconductor wafer. An associated method of linearly planarizing a surface of a semiconductor is also described.