The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 08, 2002

Filed:

Mar. 02, 2000
Applicant:
Inventors:

Kraig J. Olejniczak, Fayetteville, AR (US);

Keith C. Burgers, Fayetteville, AR (US);

Simon S. Ang, Fayetteville, AR (US);

Errol V Porter, West Fork, AR (US);

Assignee:

University of Arkansas, Little Rock, AR (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H02M 1/00 ;
U.S. Cl.
CPC ...
H02M 1/00 ;
Abstract

The design and fabrication of a highly integrated, intelligent integral horsepower, three-phase induction motor drive is based on multichip module (MCM) technology. A conventional three-phase induction motor is transformed into a stand-alone variable-speed drive by way of MCM technology. This solid-state controller-known as a multichip power module (MCPM)-uses known good die (KGD) to obtain minimal footprint, volume, and mass, while maximizing efficiency, reliability, and manufacturability. This is done by integrating the low-power control and high-power sections onto a single substrate. In accordance with one embodiment of the present invention, an integrated circuit assembly formed on a single substrate is capable of transforming and controlling AC power input to DC power output responsive to input signals. In accordance with another embodiment, an integrated circuit assembly on a single substrate is capable of receiving direct current power and controlling it and transforming it to alternating current power in single phase or multiphase form having variable magnitude and/or variable frequency. In accordance with a further embodiment, an integrated circuit assembly on a single substrate is capable of receiving alternating current power and controlling it and transforming it to alternating current power in single phase or multiphase form having variable magnitude and/or variable frequency.


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