The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 08, 2002

Filed:

Aug. 13, 1999
Applicant:
Inventors:

Jason A. Kay, Morristown, NJ (US);

David Stevens Kerr, Morris Plains, NJ (US);

John Robert Morris, Jr., Cranbury, NJ (US);

Ivan Pawlenko, Holland, PA (US);

Richard Franklin Schwartz, Cranbury, NJ (US);

Assignee:

Avaya Technology Corp., Basking Ridge, NJ (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H04B 1/500 ;
U.S. Cl.
CPC ...
H04B 1/500 ;
Abstract

An economical protective shield assembly of a dielectric substrate and an EMI shield, substantially free of the effects of board coupling and air coupling which requires less hardware for securing an EMI shield than present devices and methods, is provided for. The inventions use of simply finished shield edges with an unimproved substrate having a conductive intermediary interconnected with a grounding path and simply finished or unfinished shield edges with an improved substrate having a mating groove cooperatively adapted to fit the shield edge, interacts to exclude EMI signals and requires less precision in positioning the shield onto the substrate. The invention also provides a simplified method to exclude EMI effects for an assembly by a process of fabrication requiring less finishing steps than present processes.


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