The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 08, 2002
Filed:
Jan. 13, 1999
Applicant:
Inventors:
Kiyotsugu Mizouchi, Tokyo, JP;
Hiroshi Tsuji, Tokyo, JP;
Assignee:
Kabushiki Kaisha Toshiba, Kawasaki, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C23C 1/434 ;
U.S. Cl.
CPC ...
C23C 1/434 ;
Abstract
A method of forming a fine wiring pattern by sputtering and patterning which is characterized in that the potential difference between the anode and cathode in the sputtering apparatus is lower than 570V. The resulting fine wiring pattern is free of defects due to splash. This method is effective particularly in the production of array substrates for the flat-panel display device which needs aluminum fine lines to meet the requirement for finer pixels and larger display area.
Quick Actions:
Mizouchi, Kiyotsugu. (2002). Sputtering method for forming an aluminum or aluminum alloy fine wiring pattern (U.S. Patent No. 6461485). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6461485
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile