The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 08, 2002
Filed:
Nov. 01, 2000
Ephraim Suhir, Randolph, NJ (US);
Lucent Technologies Inc., Murray Hill, NJ (US);
Abstract
A bi-material assembly comprising two adherends, adhesively bonded. The assembly is adhesively bonded in an area consisting of a length of 2l at each end of the bonded assembly. The interface of the adherends is not completed bonded so that 2l is less than half of the assembly length. Each bonded area has an inner edge. The inner edge local interfacial shearing stress is substantially equal in magnitude to the inner edge global interfacial shearing stress causing the strength of the bi-material bonded assembly to be substantially the same as a like structure wherein 2l substantially equals half the assembly length. Further are a method of fabricating a bi-material assembly, and a semiconductor device and fabrication method.