The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 01, 2002
Filed:
Jan. 04, 2000
Shin-ichi Hamaguchi, Amagasaki, JP;
Yuzo Shimizu, Mukou, JP;
Toru Tsuruta, Suita, JP;
Masanori Hirose, Nagaokakyou, JP;
Matsushita Electronics Corporation, Osaka, JP;
Abstract
To more precisely output signals of optical recording media, a semiconductor laser element is mounted in a concave portion on the surface of a semiconductor substrate so that the optical axis of signal detecting light emitted from the semiconductor laser element is substantially parallel to the surface of the semiconductor substrate, and the light emitted from the semiconductor laser element is reflected at the side surface of the concave portion that is opposed to the signal detecting light emitting side of the semiconductor laser element in a direction substantially perpendicular to the surface of the semiconductor substrate. A light receiving portion for signal detection is provided in an area outside the concave portion on the surface of the semiconductor substrate where the semiconductor laser element is mounted. When the signal detecting light emitting side of the semiconductor laser element is the front side of the semiconductor laser element, a first light intercepting region is provided in areas posterior to, obliquely posterior to and at the left and right sides of the semiconductor laser element on the bottom surface of the concave portion, and a second light intercepting region is provided on, of the side surfaces of the concave portion, at least the side surface between the semiconductor laser element and the light receiving portion.