The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 01, 2002

Filed:

Mar. 08, 2000
Applicant:
Inventors:

Leif Bergstedt, Sjömarken, SE;

Per Ligander, Göteborg, SE;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 7/20 ;
U.S. Cl.
CPC ...
H05K 7/20 ;
Abstract

A component ( ) mounted on the board ( ) is cooled by a cooling surface ( ) in contact with a heat sink element in the form of a metal stud ( ) which, in turn, may be connected to an outer cooling surface. One method of achieving this is to form holes ( ) in a laminate ( ), etching patterns ( ), placing a metal stud ( ) in the hole ( ), applying a dielectric ( ) to the upper and lower side of the laminate ( ), forming openings ( ) in the dielectric ( ), and thereafter metal plating the entire circuit board and etching further patterns. Component can then be mounted on the printed circuit board ( ). A heat sink element ( ) includes a cutting edge ( ) and can be used beneficially in conjunction with one embodiment of the method.


Find Patent Forward Citations

Bergstedt, Leif. (2002). Method of producing printed circuit boards and a heat sink arrangement produced in accordance with the method (U.S. Patent No. 6459585). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6459585

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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