The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 01, 2002

Filed:

Nov. 01, 2000
Applicant:
Inventors:

Achyuta Achari, Canton, MI (US);

Lakhi Nandlal Goenka, Ann Arbor, MI (US);

Mohan R. Paruchuri, Canton, MI (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01B 7/08 ;
U.S. Cl.
CPC ...
H01B 7/08 ;
Abstract

A tri-metallic material for use in the manufacture of printed circuit boards is described, and the process for its manufacture is described. The tri-metallic material is a sandwich wherein a copper layer is essential the “bread” of the sandwich and an aluminum layer is the filling between both slices of bread. A metallic bonding and/or barrier layer is spread on the aluminum and is selected for its highly non-corrosive properties as well as its bonding, and diffusion inhibiting capabilities.


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Achari, Achyuta. (2002). Etched tri-layer metal bonding layer (U.S. Patent No. 6459041). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6459041

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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