The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 01, 2002
Filed:
Apr. 10, 2001
Tetsuya Hayashi, Tokyo, JP;
NEC Corporation, , JP;
Abstract
A plug material is filled inside a lower via hole formed in a lower interlayer insulating film, thereby to create a void inside the lower via hole. The void is filled with a filling material. Even if a film formed on the surface of the lower interlayer insulating film is etched, the void is prevented from being expanded. An upper interlayer insulating film is formed on the lower interlayer insulating film. The upper interlayer insulating film is etched so as to form an upper via hole in an area just above the lower vial hole. As a result of this etching, the filling material is removed, so that the void can not be expanded. After this, predetermined upper wiring, etc. is formed, thus completing a semiconductor device.