The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 01, 2002

Filed:

Aug. 08, 2000
Applicant:
Inventors:

Masato Tawara, Tokyo, JP;

Toshiyuki Ebara, Saitama, JP;

Kazuhiko Hatakawa, Kanagawa, JP;

Sadayuki Ito, Kanagawa, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 7/072 ;
U.S. Cl.
CPC ...
B29C 7/072 ;
Abstract

The invention provides a resin-sealing apparatus that is operated with a low pressure and with a low clamping force without void generation and that is favorable for shortening the molding time and reduction of sealing resin consumption. In the resin-sealing apparatus of the present invention, a resin injection inlet of a pot has an opening at the center of the cavity surface of a cavity of a bottom mold that is a component of a mold unit, and a plunger for injecting molten resin in the pot from the opposite side to the resin injection inlet side is provided slidably and airtightly with the inside wall of the pot.


Find Patent Forward Citations

Tawara, Masato. (2002). Resin-sealing apparatus (U.S. Patent No. 6457963). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6457963

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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