The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 01, 2002
Filed:
Mar. 24, 1999
Applicant:
Inventors:
Akira Takashima, Kawasaki, JP;
Kazuya Kamimura, Aizuwakamatsu, JP;
Yoshikazu Kumagaya, Kawasaki, JP;
Assignee:
Fujitsu Limited, Kawasaki, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K 3/102 ;
U.S. Cl.
CPC ...
B23K 3/102 ;
Abstract
A method of forming a semiconductor device mounts solder balls on a resin board which has holes formed therethrough and conductive sheets formed therebeneath to cover bottom ends of the holes. The method includes the steps of applying solder paste on the holes, melting the solder paste by heat to make solder of the solder paste flow into the holes and establish contact with the conductive sheets, and connecting the solder balls to the solder filled in the holes.