The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 24, 2002

Filed:

Sep. 18, 2000
Applicant:
Inventors:

Ponnuswamy Palanisamy, Landsdale, PA (US);

Attiganal Narayanaswamy Sreeram, Edison, NJ (US);

Ellen Schwartz Tormey, Princeton Jct., NJ (US);

Barry Jay Thaler, Lawrenceville, NJ (US);

John Connolly, Clarksburg, NJ (US);

Ramon Ubaldo Martinelli, Hightstown, NJ (US);

Ashok Narayan Prabhu, East Windsor, NJ (US);

Mark Stuart Hammond, Pennington, NJ (US);

Assignee:

Lamina Ceramics, Inc., West Ampton, NJ (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/334 ;
U.S. Cl.
CPC ...
H01L 2/334 ;
Abstract

Integrated packages incorporating multilayer ceramic circuit boards mounted on a metal support substrate can be used for temperature control by the metal support substrate. Various electronic components, as well as additional temperature control devices, can be connected to the circuit boards and to the metal support substrate to control or regulate the temperature of operation of the components. The integrated package can be hermetically sealed with a lid.


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