The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 24, 2002

Filed:

Nov. 09, 1999
Applicant:
Inventors:

Yoshiaki Saito, Ichihara, JP;

Tomokazu Abe, Ichihara, JP;

Terunobu Fukushima, Maebashi, JP;

Assignee:

Other;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 3/312 ; B29C 4/514 ; B29C 4/556 ;
U.S. Cl.
CPC ...
B29C 3/312 ; B29C 4/514 ; B29C 4/556 ;
Abstract

A molding die for molding a laminated molding having a molding body with compressible surface members and partially laminated thereonto, where a flow-regulating portion for regulating flow of molten resin flowing toward the surface members and is provided to a die body to regulate the flow of the molten resin flowing on the same plane as the surface members and toward the surface members and . Accordingly, since resin lap at an peripheral end portion of the surface members and , and position shift of the surface members and by the flow of the resin, laminated molding having good quality and appearance can be obtained.


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