Compound motion apparatus for applying twist-ties to flexible packages

Abstract

A device and method of use for applying twist-ties onto flexible packages on an assembly line. Each package has a front panel including an exterior surface. Each twist-tie is a strip of material having a first face. The apparatus comprises a glue applicator (e.g., a spray head), a supply (e.g., reel) of twist-tie material, a carrier (e.g., channel shaped head including magnets), and a package support (e.g., conveyor). The package support holds each package at a first station in an orientation whereupon the exterior surface of the front panel is oriented vertically. The carrier is arranged to be oriented in a first horizontal position for receipt of a respective twist-tie thereon so that the first face of the twist-tie is facing upward. The glue applicator applies glue (e.g., sprays hot glue) downward onto the first face of the twist-tie as it is advanced onto the carrier. The carrier is pivotable to a position so that the glued first face of the twist-tie is oriented in a vertical plane facing the exterior surface of the front panel of the package and is then movable in a horizontal direction to carry the twist-tie into engagement with the exterior surface of the front panel of the package to fixedly secure the twist-tie thereon. The carrier includes an air jet to aid in the release of the twist-tie from the magnetic holding of the carrier. The carrier is then brought back to its original position for receipt of another glue-bearing twist-tie thereon.