The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 17, 2002
Filed:
Jan. 30, 2001
Applicant:
Inventor:
Masaki Shimoda, Hyogo, JP;
Assignee:
Mitsubishi Denki Kabushiki Kaisha, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/940 ; H01L 2/302 ;
U.S. Cl.
CPC ...
H01L 2/940 ; H01L 2/302 ;
Abstract
A semiconductor device with more scale reduction and without restriction of arrangement of connection pads for preventing them from being covered is obtained. The semiconductor device has first and second semiconductor chips stacked on a substrate, wherein a connection pad of the first semiconductor chip faces the substrate, and the first and second semiconductor chips are both connected to input/output terminals of the substrate by means of wires.