The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 17, 2002
Filed:
Nov. 17, 2000
Joseph Benedetto, Monument, CO (US);
Aeroflex UTMC Microelectronic Systems, Inc., Colorado Springs, CO (US);
Abstract
A radiation shielded integrated circuit device comprises an integrated circuit die and a first layer of shielding material supporting the integrated circuit die. The first layer has a central portion having a first thickness having an area at least as large as the area of the IC die, and an outer portion having a second thickness less than the first thickness. A wall of ceramic material has a first edge connected to the outer portion of the first layer of shielding material. The wall of ceramic material has an inner surface defining, in conjunction with the first layer of shielding material, a well containing the integrated circuit die. A plurality of wire bond pads are supported by the inner surface of the ceramic wall. A plurality of input/output pads are connected to an exterior surface of the ceramic walls. Conducting material extending through the ceramic material connects each of the wire bond pads to a respective one of input/output pads. Wire bands connect the integrated circuit die to the wire band pads. A second layer of shielding material is connected to a second edge of the ceramic wall. A radiation shield is also disclosed.