The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 17, 2002
Filed:
Feb. 12, 2001
Nitin Juneja, Fremont, CA (US);
LSI Logic Corporation, Milpitas, CA (US);
Abstract
A BGA package wherein power is provided to the die through power (Vdd) balls which are located in an inner most row of solder balls. By arranging the power balls in an inner most row, it is possible to reduce the distance the electrical signal has to travel to reach a power ring. Preferably, ground is provided to the die through ground (Vss) balls which are dispersed in a ball field around the periphery of the inner most row of power balls. Preferably, the ground balls are paired together, because by pairing the ground balls, it is possible to use only one via for two ground balls on the system board. This reduces the number of layers needed on the system board to route all of the pins and may make it possible, for example, to route more traces on the system board.