The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 17, 2002
Filed:
Oct. 04, 1999
Applicant:
Inventor:
Stuart E. Greer, Austin, TX (US);
Assignee:
Motorola, Inc., Schaumburg, IL (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/144 ;
U.S. Cl.
CPC ...
H01L 2/144 ;
Abstract
A mostly copper-containing interconnect ( ) overlies a semiconductor device substrate ( ), and a transitional metallurgy structure ( ) that includes an aluminum-containing film ( ) contacts a portion of the mostly copper-containing interconnect. In one embodiment, the transitional metallurgy is formed over a portion of a bond pad ( ). In an alternative embodiment, the transitional metallurgy includes an energy alterable fuse portion ( ) that electrically contacts two conductive regions ( and ), and in yet another embodiment, the transitional metallurgy is formed over a copper-containing edge seal portion ( ).