The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 17, 2002

Filed:

Jul. 12, 2001
Applicant:
Inventors:

Karl Neumeier, Unterhaching, DE;

Dieter Bollmann, München, DE;

Assignee:

Other;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/176 ;
U.S. Cl.
CPC ...
H01L 2/176 ;
Abstract

The invention relates to a method of producing calibration structures in semiconductor substrates in the manufacture of components, specifically micro-mechanical systems with integrated semiconductor electronic systems. In the method a first layer ( ) is structured on a first substrate ( ) to produce first areas ( ) which are required for the function of the components. Moreover, second areas ( ) are produced in the first layer ( ), which represent the calibration structures. The second areas ( ) present a refractive index different from the refractive index of adjoining areas. Subsequently, the first substrate ( ) is joined with a second substrate ( ) such that the first layer ( ) will be enclosed between the two substrates. Then either the first or the second substrate is thinned down to a residual thickness. The substrate layer with this residual thickness constitutes, for instance, the membrane in a pressure sensor. The inventive method does not entail a weakening of the mechanical properties of supporting layers. The method may be integrated into the manufacturing process without additional process steps or complex and expensive etching techniques.


Find Patent Forward Citations

Loading…