The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 17, 2002
Filed:
Feb. 11, 1999
Kazuo Tsurugai, Utsunomiya, JP;
Hisao Tokoro, Utsunomiya, JP;
JSP Corporation, Tokyo, JP;
Abstract
A shock-absorbing material composed of an expansion-molded article of polypropylene resin particles is excellent in shock-absorbing property and impact resilience compared with shock-absorbing materials composed of other resin materials, but has not been said to be satisfactory in stiffness and energy absorption efficiency. The present invention relates to a shock-absorbing material composed of an expansion-molded article produced by using foamed particles comprising, as a base resin, a polypropylene homopolymer obtained by using a metallocene polymerization catalyst. The base resin has a tensile modulus of at least 15,000 kgf/cm , and the expansion-molded article has a crystal structure that an inherent peak a and a high-temperature peak b appear as endothermic peaks on a DSC curve obtained by the differential scanning calorimetry of the molded article. The high-temperature peak b is a peak appeared on the temperature side higher than a temperature corresponding to the inherent peak a, and the quantity of heat at the high-temperature peak is at least 25 J/g.