The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 17, 2002

Filed:

Jan. 18, 2001
Applicant:
Inventors:

Tatsumi Kimura, Kurashiki, JP;

Fumimaru Kawabata, Kurashiki, JP;

Keniti Amano, Kurashiki, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C21D 8/00 ; C21D 7/13 ; C22C 3/842 ; C22C 3/850 ;
U.S. Cl.
CPC ...
C21D 8/00 ; C21D 7/13 ; C22C 3/842 ; C22C 3/850 ;
Abstract

The present invention relates to an H-shaped steel used as a building structure such as a column material or the like for highrise and super highrise building structures. In the bainite structure of extra-low-carbon steel, diffusive &agr; is finely dispersed in &agr; to ensure tensile strength at the 590-MPa level and significantly improve toughness in the direction of the flange thickness. Fine dispersion of &agr; is achieved by controlling Mn and Cu in proper ranges. In other word, the present invention provides 590MPa class heavy gauge H-shaped steel with excellent as-rolled toughness in the direction of the flange thickness, containing 0.001 to 0.025 wt % of C, 0.6 wt % or less of Si, 0.4 to 1.6 wt % of Mn, 0.025 wt % or less of P, 0.010 wt % or less of S, 0.1 wt % or less of Al, 0.6 to 2.0 wt % of Cu, 0.25 to 2.0 wt % of Ni, 0.001 to 0.050 wt % of Ti, and 0.0002 to 0.0030 wt % of B, wherein Mn/Cu≦2.0 and 250≦117 Mn (wt %)+163 Cu (wt %)≦350 are satisfied.


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