Transparent substrate and hinged optical assembly

Abstract

A method and apparatus are provided for providing an electro-optic signal processing device. The method includes the steps of providing an optically transparent substrate having first and second planar elements with an abutting common edge, the planar elements lying at differing angles with respect to each other about the common edge and a plurality of alignment apertures formed in the substrate. A plurality of optical devices of an optical array are disposed on the first planar element of the substrate, with transmission paths of the optical devices passing directly through the substrate. A signal processor is also disposed on the first planar element of the substrate. An optical fiber holder comprising a plurality of respective optical fibers and guide pin apertures disposed on a first surface of the optical fiber holder is aligned to the optical array using the guide pins and guide pin apertures. Optical signals of the optical devices of the optical array are coupled to respective optical fibers of the aligned optical fiber holder. A printed circuit board having a first surface is attached to a mating surface of the substrate's second planar element.