The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 10, 2002
Filed:
Aug. 25, 2000
Rahul V. Gune, Nonthaburi, TH;
Watcharin Pinlam, Pathumthanee, TH;
Youthachai Bupparit, Nonthaburi, TH;
Advanced Micro Devices, Inc., Sunnyvale, CA (US);
Abstract
A method and apparatus are provided for transferring packaged integrated circuits (“ICs”) from one JEDEC standard tray to another without manual handling of the ICs. Embodiments include a pick and place system for moving ICs from a first tray to a second tray, such as x and y axis stepper motors, motor drivers and a head for picking up and placing the ICs by vacuum. The pick and place system is controlled by a processor, such as a personal computer, that receives instructions from an input device, such as a keyboard, monitor and/or mouse. A first tray of ICs to be batched and a second tray to which the ICs are to be transferred are brought to the system. The operator enters, via a user-friendly graphical display, data relating to the package to be transferred, the quantity of devices to be transferred, and the positions of the devices in the trays. The processor then controls the pick and place system to transfer the inputted quantity of devices from the first to the second tray based on the device positional information entered by the operator. Since there is no manual handling of the ICs, damage to the devices, such as bent leads, is eliminated, as is misorientation and miscounting of devices.