The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 10, 2002
Filed:
Oct. 14, 1998
Takahito Nakazawa, Yokohama, JP;
Yoshiaki Sugizaki, Yokohama, JP;
Kabushiki Kaisha Toshiba, Kawasaki, JP;
Abstract
In order to suppress the warp of a semiconductor package of an over-coat structure, when thermal expansion coefficient, Young's modulus and thickness of the wiring substrate are &agr;s, Es and Hs, respectively, and thermal expansion coefficient, Young's modulus and thickness of the resin layer are &agr;r, Er and Hr, respectively, the value R of (&agr;r·Er·Hr)/(&agr;s·Es·Hs) is set to be approximately 0.6 or more. With adoption of such a configuration, stress exerting on a semiconductor package can be effectively alleviated, and coplanarity of the semiconductor package can be improved.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile