The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 10, 2002
Filed:
Apr. 26, 2000
Applicant:
Inventor:
Melissa Siow-Lui Lee, San Jose, CA (US);
Assignee:
Advanced Micro Devices, Inc., Sunnyvale, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/348 ; H01L 2/352 ; H01L 2/940 ;
U.S. Cl.
CPC ...
H01L 2/348 ; H01L 2/352 ; H01L 2/940 ;
Abstract
A circuit assembly is formed with a lower die and an upper die, offset and stacked on the lower die. A resilient, e.g., elastomeric, O-ring is disposed about the periphery and adjacent side surfaces of the lower die to support the overhanging parts of the upper die. The supporting O-ring prevents the generation of stress inducing cracks in the upper die during wire bonding to bond pads on the overhanging parts of the upper die.
Lee, Melissa Siow-Lui. (2002). Stacked die design with supporting o-ring (U.S. Patent No. 6448659). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6448659
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile