The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 10, 2002
Filed:
May. 14, 1999
Mukul Saran, Richardson, TX (US);
Charles A. Martin, Melissa, TX (US);
Ronald H. Cox, Plano, TX (US);
Texas Instruments Incorporated, Dallas, TX (US);
Abstract
A reinforcing system and method of fabrication for a semiconductor integrated circuit bond pad comprises a first dielectric layer or stack disposed under the bond pad; at least one second dielectric layer or stack disposed under the first dielectric layer; and a reinforcing metal structure disposed into the second dielectric layer such that the patterns of the metal structure and the second dielectric layer comprise a uniformly flat interface towards the first dielectric layer. The patterns of the metal structure and the second dielectric layer comprise feature sizes and fine pitches used in the integrated circuit.