The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 10, 2002
Filed:
Mar. 07, 2000
Applicant:
Inventors:
Yoshiaki Suenaga, Kyoto, JP;
Tatsuo Kishino, Kyoto, JP;
Assignee:
Rohm Co., Ltd., Kyoto, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/348 ;
U.S. Cl.
CPC ...
H01L 2/348 ;
Abstract
A multi-layered integrated semiconductor device incorporates an upper and lower IC chips which are connected with each other via a first set of wiring pads of the upper IC chip to a second set of wiring pads of the lower IC chip. The device is provided with a multiplicity of pair-wise connected external monitoring terminals on the periphery of the upper IC chip, and a multiplicity of monitoring pads on the lower IC chip, in opposition to the pair-wise connected monitoring pads, so that pad-to-pad resistances between the pads of the upper and lower IC chips can be externally measured by directly connecting the monitoring pads to the external terminals.