The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 10, 2002
Filed:
Sep. 27, 1999
Shoji Ohtani, Wakayama, JP;
Yasuhiro Doi, Wakayama, JP;
Yoshinobu Ishikawa, Wakayama, JP;
Toshitaka Sakuda, Wakayama, JP;
Kenichi Shiba, Wakayama, JP;
Toyo Ink Manufacturing Co., Ltd., Tokyo, JP;
Abstract
The present invention provides a pressure-sensitive adhesive having a storage modulus from 1×10 to 1×10 dyne/cm and at a frequency of 1 Hz; and having a gel fraction of 55% or more when the storage modulus is measured at a temperature of 25° C. in dynamic viscoelasticity measurement. Its pressure-sensitive adhesive product can be obtained by the process, for example, for producing the (meth)acrylate emulsion-type pressure-sensitive adhesive which comprises adding the polymerization-initiator(s) at separate multi-steps to the present reaction system in the presence of polymerization-initiator(s) at the time of polymerizing alkyl (meth)acrylate and which comprises using a water-soluble polymerization-initiator at least one time during or after the second step of adding the polymerization-initiator(s).