The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 10, 2002
Filed:
Sep. 03, 1999
Kenichi Sakai, Yokohama, JP;
Susumu Shimada, Tsukuba, JP;
Masaaki Kumamura, Yokohama, JP;
Masahiro Watabe, Yokohama, JP;
Kentaro Niwano, Yamato, JP;
Canon Kabushiki Kaisha, Tokyo, JP;
Abstract
There is provided a molding method of a thermosetting resin in which the formation of a flash can be prevented. This molding method comprises pouring or injecting the thermosetting resin into a mold, and then heating and molding it, and the method further comprises the step of locally heating an unnecessary gap and its peripheries of the mold, which are not concerned with the molding of the thermosetting resin into a desired article having a required shape, whereby the resin in the gap and its peripheries are promptly set to reduce the leakage of the resin into the unnecessary gap.