The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 03, 2002

Filed:

Jul. 20, 2000
Applicant:
Inventors:

Kazuyuki Nakagawa, Tokyo, JP;

Michitaka Kimura, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 7/06 ;
U.S. Cl.
CPC ...
H05K 7/06 ;
Abstract

A lower semiconductor element is mounted facing down on an insulating circuit board, and an upper semiconductor element is stacked facing up on the lower semiconductor element. Openings are provided in the insulating circuit board at a location facing the element electrodes of the lower semiconductor element, and the element electrodes of the lower semiconductor element are connected to the board electrodes on the lower surface of the insulating circuit board through the openings. Also, the element electrodes of the upper semiconductor element are connected to the board electrodes on the upper surface of the insulating circuit board. Thus, a high-density semiconductor device is provided by stacking a plurality of semiconductor elements.


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