The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 03, 2002

Filed:

Jul. 05, 2001
Applicant:
Inventors:

Guenther Riehl, Buehlertal, DE;

Bernhard Severin, Buehlertal, DE;

Assignee:

Robert Bosch GmbH, Stuttgart, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 ;
U.S. Cl.
CPC ...
H05K 7/20 ;
Abstract

To achieve an effective dissipation of the heat generated by the power components including a design that is as compact as possible as well as simple assembly in the case of an electronic control unit having a printed circuit board situated in a closed housing and provided with electrical and/or electronic components, and having, arranged at the housing, at least one connector part whose contact elements, which are partially embedded in the housing, are electrically connected to the printed circuit board, it is proposed that the housing includes a housing frame produced as an injection-molded part and having an open topside and bottom side, metallic conductor strips formed by at least one punched grid being partially embedded in the housing frame. Furthermore, it is also proposed that the bottom side of the housing frame is closed by a metallic base part provided as a heat sink, and the topside is closed by a cover part; and that provided between the base part and the printed circuit board are power components, whose leads are in contact with the printed circuit board and/or the conductor strips, and whose underside, which is formed by a cooling plate, and which faces away from the printed circuit board, is connected in a heat conducting manner to the base part.


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