The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 03, 2002
Filed:
Mar. 20, 2002
Advanced Micro Devices, Inc., Sunnyvale, CA (US);
Abstract
A sliding tray holder is coupled to an IC (integrated circuit) package test system having a plurality of test stations, for holding the trays of IC packages during testing of a high quantity of IC packages through the plurality of test stations. The sliding tray holder includes a platform for holding a first tray of untested IC packages and for holding a second tray of tested IC packages. Each untested IC package from the first tray of untested IC packages is loaded to at least one of the plurality of test stations for testing of the untested IC package such that the untested IC package becomes a tested IC package. The tested IC package is unloaded from one of the plurality of test stations to the second tray of tested IC packages. The platform holds the first tray of untested IC packages and the second tray of tested IC packages such that an operator does not hold the first tray and the second tray during loading of the untested IC packages to the plurality of test stations from the first tray and during unloading of the tested IC packages from the plurality of test stations to the second tray. A linear slide holds the platform and guides the platform holding the first tray and the second tray along the plurality of test stations as the platform is moved along the plurality of test stations during loading of the untested IC packages to the plurality of test stations from the first tray and during unloading of the tested IC packages from the plurality of test stations to the second tray. In this manner, the operator is relieved from constantly holding trays of IC packages during testing of a high quantity of IC packages.