The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 03, 2002

Filed:

May. 04, 1999
Applicant:
Inventor:

Patrick Petre, Cauville sur Mer, FR;

Assignee:

Sidel, Inc., Norcross, GA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 4/964 ;
U.S. Cl.
CPC ...
B29C 4/964 ;
Abstract

An improved blow mold shell, and a blow mold shell assembly, for use in blow molding containers is disclosed. The blow mold shell comprises an elongate unitary blow mold shell body defining a partial molding cavity, the partial molding cavity having a container neck forming portion and a container body forming portion. A first continuous cooling circuit is defined within the shell with respect to the neck forming portion of the molding cavity. A second separate, and independent, continuous cooling circuit is defined within the shell with respect to the body forming portion of the molding cavity. So constructed, the neck and body portions of a blow mold container may be separately cooled, and/or heat-treated, as desired, during the molding process to allow the sidewall portion of the container to be molded in as thin a sidewall section as possible in contrast to the neck portion of the container. The shell assembly is comprised of two substantially identical ones of the blow mold shells releasably mated to one another, and also includes a base assembly received at the second end of the blow mold shells. The base assembly defines a base portion of the molding cavity, and has a separate cooling circuit for cooling the base forming portion of the molding cavity.


Find Patent Forward Citations

Loading…