The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 03, 2002

Filed:

Jun. 14, 2000
Applicant:
Inventors:

Katsumi Ryoke, Odawara, JP;

Tadashi Ishiguro, Odawara, JP;

Assignee:

Fuji Photo Film Co., Ltd., Kanagawa-Ken, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24D 3/02 ; B24D 1/100 ;
U.S. Cl.
CPC ...
B24D 3/02 ; B24D 1/100 ;
Abstract

A polishing member for use in polishing of an end face of an optical fiber connector ferrule comprises a substrate and a polishing layer, which is overlaid on the substrate and which comprises a binder and fine polishing particles dispersed in the binder. Agglomerated fine silica particles having a mean particle size falling within the range of 0.1 &mgr;m to 4 &mgr;m are utilized as the fine polishing particles contained in the polishing layer, and a thickness of the substrate falls within the range of 25 &mgr;m to 150 &mgr;m. The polishing with the polishing member is performed while a polishing liquid, which is constituted of water or a silica slurry, is being supplied onto a surface of the polishing layer. The polishing liquid is free from a base or an acid. The polishing layer has a dry thickness falling within the range of 5 &mgr;m to 15 &mgr;m.


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