The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 03, 2002

Filed:

May. 30, 2000
Applicant:
Inventors:

Fumio Morita, Tokyo, JP;

Masataka Fujiki, Tokyo, JP;

Hitoshi Oka, Tokyo, JP;

Noriyuki Oroku, Kanagawa-ken, JP;

Yuichirou Tanaka, Kanagawa-ken, JP;

Assignee:

Other;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B08B 3/02 ;
U.S. Cl.
CPC ...
B08B 3/02 ;
Abstract

The fluid treatment apparatus, as disclosed, comprises upper and lower Bernoulli-plates and each of which includes a metal plate provided on overall outer surface thereof. On each of the metal plates there is arranged a spiral-shaped circulating pipe through which a heating medium or a cooling medium are circulated so as to rapidly heat or cool the upper and lower Bernoulli-plates. During the treatment of a wafer by the apparatus, the upper and lower Bernoulli-plates are disposed in parallel with each other to define a narrow gap therebetween while a clearance between the wafer and the upper Bernoulli-plate and a clearance between the wafer and the lower Bernoulli-plate are kept to be equal to each other. Thus, the present invention can achieve various purpose such as a time saving for the cleaning, reduction of consumption of the cleaning liquid and inhibition of cleaning irregularity.


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