The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 27, 2002

Filed:

Nov. 07, 2001
Applicant:
Inventors:

Jonathan W. Goodwin, Braintree, MA (US);

Curtis G. Knaub, North Attleboro, MA (US);

Assignee:

Tyco Electronics Corporation, Middletown, PA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 9/00 ;
U.S. Cl.
CPC ...
H05K 9/00 ;
Abstract

A method for securing a contact assembly to a frame in an integrated circuit socket via cold forming. A plurality of posts are integrally formed with and extend from the bottom surface of the frame of an integrated circuit device socket. The contact assembly includes a plurality of conductive columns mounted within an insulating sheet in a predetermined contact pattern. The insulating sheet also has a plurality of post receiving apertures that are selectively positioned such that the posts extend through corresponding apertures in the insulating sheet when the contact assembly is positioned in a mounting position on the bottom surface of the frame. The posts are cold staked to expand the diameter of the post ends and to secure the contact assembly to the frame. Integral spacer abutments are provided on the bottom surface of the frame to provide a planar mounting surface for the socket and to precisely space the insulating sheet from the printed circuit board when the socket is mounted to the printed circuit board.


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