The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 27, 2002
Filed:
Jan. 03, 2001
Hiroshi Nakamura, Ome, JP;
Katsumi Hisano, Kashiwa, JP;
Kentaro Tomioka, Sayama, JP;
Hiroshi Aoki, Nagaoka, JP;
Katsuhiko Yamamoto, Nagaoka, JP;
Other;
Abstract
A cooling unit for cooling a semiconductor package has a heat sink and an electric fan device. The heat sink includes a heat receiving portion for heat generated by the semiconductor package, and a heat exchange portion thermally connected to the heat receiving portion. The heat exchange portion is located adjacent to the heat receiving portion and separate from the semiconductor package. The heat sink is movable toward and away from the semiconductor package, and always urged by a plate spring toward the semiconductor package. The electric fan device sends cooling air at least to the heat exchange portion of the heat sink.