The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 27, 2002
Filed:
Jan. 31, 2001
Hajime Maeda, Tokyo, JP;
Yasunori Ikeda, Tokyo, JP;
Mitsubishi Denki Kabushiki Kaisha, Tokyo, JP;
Abstract
In an integrated circuit package, a deformed IC lead is reliably connected with a land for mounting. Such reliable connection between the deformed IC lead and a land is realized by a method for mounting an integrated circuit package wherein a non deformed first lead and a deformed second lead in the integrated circuit package are connected to a first land and a second land on a substrate, respectively. comprising a step for supplying a conductive material on a land wherein a larger amount of the conductive material than that of the first land is supplied to the second land; and a step for melting the conductive material supplied to connect a lead with a land wherein the conductive material molten on the first land extends in the vertical direction with respect to the substrate with a first height thereby connecting the first lead with the first land, while the conductive material molten on the second land extends with a higher second height than the first height due to surface tension thereby connecting the second lead with the second land.