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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 6441319 B1

PDFFull Text
Date of Patent:
Aug. 27, 2002

Filed:

Dec. 28, 2000

Inserted components for via connection of signal tracks to achieve continuous impedance matching in multi-layer substrate

Applicant:
Inventors:

Martin R. Handforth, Kanata, CA;

Herman Kwong, Kanata, CA;

Richard R. Goulette, Arnprior, CA;

Rolf G. Meier, Carp, CA;

Assignee:

Nortel Networks Limited, , CA;

Attorney:

Hunton & Williams

Primary Examiner:

Albert W Paladini

Int. Cl.
CPC ...
H01R 9/09 ;
U.S. Cl.
CPC ...
H01R 9/09 ;
Abstract

A technique for connecting signal tracks within a multi-layer substrate is disclosed. In one embodiment, the technique is realized by providing an opening in a substrate and fitting an inserted component into the opening. The inserted component comprises a dielectric block mounted to a lead frame. The lead frame is conductive such that a signal layer formed between the inserted component and the substrate connects signal tracks on multiple signal layers of the substrate.

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Handforth, Martin. (2002). Inserted components for via connection of signal tracks to achieve continuous impedance matching in multi-layer substrate (U.S. Patent No. 6441319). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6441319

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