The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 27, 2002
Filed:
Dec. 22, 1999
Yoshiaki Saito, Ichihara, JP;
Tomokazu Abe, Ichihara, JP;
Shigeki Tamura, Yashio, JP;
Tsuneo Matsui, Sanjo, JP;
Idemitsu Petrochemical Co., Ltd., Tokyo, JP;
Abstract
A molding die drive unit capable of both of compressing and expanding (volume enlargement) molten resin in molding die and having thin shape and superior mechanical efficiency, molding unit and molding process are provided. A molding die drive unit for advancing and retracting a movable die B relative to a cavity C has a large-diameter main cylinder unit , and a plurality of small-diameter sub cylinder unit disposed around the main cylinder unit . After loading the molten resin, the cylinder units and are driven to advance and retract the movable die B to the cavity C to compress or expand the molten resin in the cavity to conduct molding process.