The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 27, 2002
Filed:
Apr. 13, 2000
Masao Kamiguchi, Yamanashi, JP;
Tatsuhiro Uchiyama, Yamanashi, JP;
Katsuya Sakaba, Otsu, JP;
Shusaku Nishiyama, Kawasaki, JP;
Ikushi Takasaki, Kawasaki, JP;
Other;
Abstract
A resin flow analysis in a die is performed by CAE or the like to obtain a resin pressure curve at a resin inlet port or a resin pressure curve at a nozzle end portion of a molding machine. Injection (air shot) is performed while a nozzle is separated from a die, so that an injection pressure curve Pa to be detected at this time is obtained. From the injection pressure curve and the resin pressure curve, an injection pressure command curve serving as a molding condition in mass production is obtained. The resin pressure curve obtained by the resin flow analysis is compensated by the injection pressure curve in an air shot for a time lag and pressure loss caused by the mechanical elements of an injection molding machine, so that molding conditions in mass production can be easily obtained. In addition, a pressure loss at the nozzle portion is also obtained, so that an injection pressure command curve is obtained from the pressure loss, the injection pressure curve, and the resin pressure curve.